PC457L0NIP0F

PC457L0NIP0F

SHARP MICROELECTRONICS

光隔离器 - 晶体管,光电输出
OPTOISO 3.75KV TRANSISTOR 5-SMD
EU RoHSCompliant
Output TypeDC
Input TypeDC
Output DeviceTransistor With Base
Number of Channels per Chip1
Minimum Isolation Voltage (Vrms)3750
Minimum Operating Temperature (°C)-55
Maximum Operating Temperature (°C)85
Maximum Forward Voltage (V)1.95
Maximum Current Transfer Ratio (%)50
Maximum Collector Current (mA)8
Maximum Power Dissipation (mW)100
Maximum Reverse Voltage (V)5
Maximum Forward Current (mA)25
PackagingTape and Reel
Temperature GradeIndustrial
MountingSurface Mount
Package Height (mm)2.6
Package Length (mm)3.6
Package Width (mm)4.4
PCB changed5
Standard Package NameSOIC
Supplier PackageMini-Flat
Pin Count5
Lead ShapeGull-wing
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PC457L0NIP0FSeries1.Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC457L)2. Approved by VDE, DIN EN60747-5-2() (as an op- tion), file No. 40009162 (as model No. PC457L)3. Package resin : UL flammability grade (94V-0)()DIN EN60747-5-2 : successor standard of DIN VDE0884 Features Agency approvals/ComplianceHigh Speed 1Mb/s, High CMR Mini-flat Package OPIC Photocoupler1. Mini-flat 5 pin package2. Double transfer mold package (Ideal for Flow Soldering)3. High speed response (tPHL : TYP. 0.2 µs, tPLH : TYP. 0.4 µs) 4. High noise immunity due to high instantaneous com-mon mode rejection voltage (CMH : MIN. 15kV/µs, CML : MIN. 15kV/µs)5. High isolation voltage between input and output (Viso(rms) : 3.75 kV)6. Lead-free and RoHS directive compliant DescriptionPC457L0NIP0F Series contains a LED optically cou-pled to an OPIC chip.It is packaged in a 5 pin Mini-flat. Input-output isolation voltage(rms) is 3.75 kV. High speed response (TYP. 1Mb/s) and CMR is MIN. 15 kV/µs.1Sheet No.: D2-A05102ENDate Jun. 30. 2005© SHARP CorporationNoticeThe content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.PC457L0NIP0F Series"OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip.1. Programmable controller2. Inverter Applications Internal Connection Diagram2Sheet No.: D2-A05102EN Outline Dimensions(Unit : mm)1. Mini-flat Package [ex. PC457L0NIP0F]2. Mini-flat Package (VDE option) [ex. PC457L0YIP0F]Plating material : SnCu (Cu : TYP. 2%)Product mass : approx. 0.1gProduct mass : approx. 0.1gPC457L0NIP0F SeriesPC457L134.4±0.25.3±0.32.6±0.20.1±0.13.6±0.31.27±0.251.27±0.250.4±0.10.5+0.40.27.0+0.20.7Epoxy resin45û6û0.2±0.05645Date codeFactory identification markAnodemarkSHARP mark "S"134.4±0.25.3±0.32.6±0.20.1±0.13.6±0.31.27±0.251.27±0.250.4±0.10.5+0.40.27.0+0.20.7Epoxy resin45û6û0.2±0.05645Date codeFactory identification markPC457LAnodemark4VDE Identification markSHARP mark "S"AnodeCathodeGNDVO (Open collector)VCC1345616543Date code (2 digit)A.D.1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001MarkAB CDEFHJKLMNMarkPRSTU VWX ABCMark1 2 3 4 5 6 7 8 9ONDMonthJanuaryFebruaryMarchAprilMay JuneJulyAugustSeptemberOctoberNovemberDecemberA.D2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012áá ááá á2nd digitMonth of production1st digitYear of production3repeats in a 20 year cycleSheet No.: D2-A05102ENPC457L0NIP0F SeriesFactory identification markFactory identification Markno markCountry of originJapanIndonesiaChina* This factory marking is for identification purpose only.Please contact the local SHARP sales representative to seethe actual status of the production.Rank markThere is no rank mark indicator.Sheet No.: D2-A05102EN Absolute Maximum Ratings4 Electro-optical Characteristics*7PC457L0NIP0F Series*1 When ambient temperature goes above 70ûC, the power dissipation goes down at 0.8mA/ûC. (Fig.3)*2 When ambient temperature goes above 70ûC, the power dissipation goes down at 1.5mW/ûC. (Fig.4)*3 When ambient temperature goes above 70ûC, the power dissipation goes down at 1.8mW/ûC. (Fig.4)*4 40 to 60%RH, AC for 1minute, f=60Hz*5 For 10sParameterSymbolRatingUnit Forward currentIF25mA mAReverse voltageInputOutputVR5VVPower dissipationP45 Output currentSupply voltageOutput voltagePower dissipationTotal power dissipation1008mW100mW mWVOPOIOVVCCViso (rms)PtotkVOperating temperatureTopr55 to +12555 to +850.5 to +300.5 to +20ûCûCStorage temperatureIsolation voltageTstg*4*3*3*2*1*5Soldering temperatureTsol2603.75ûC(Ta=25ûC)ParameterSymbolUnit InputForward voltageVFVReverse currentI RµATerminal capacitanceC tV=0, f=1MHzIF=0, VCC=5.5V, VO=5.5VpF%%OutputIOH (1)µAµAHigh level supply current (1)I CCH (1)High level supply current (2)I CCH (2)nATransfercharac-teristicstPLHµstPHLµsCurrent transfer ratio (1)IF=0, VCC=5V, VCM=1.0kV(p-p), RL=1.9kIF=16mA, VCC=5V, VCM=1.0kV(p-p), RL=1.9kkV/µsInstantaneous common mode rejection voltage (High level output)Instantaneous common mode rejection voltage (Low level output)CMLkV/µsIF=16mAVR=5VIF=0, VCC=15V, VO=OPENIF=16mA, VCC=5VRL=1.9MIN.1515MAX.10250501.950.80.8Conditions"LowHigh" propagation delay time"HighLow" propagation delay timeCMHIsolation resistanceCTR (1)Floating capacitanceCTR (2)IF=16mA, VCC=4.5V, VO=0.4V, RL=1.9k*6 Ta=0 to 70ûC*7 It shall connect a by-pass capacitor of 0.01µF or more between VCC (pin 6 ) and GND (pin 4 ) near the device, when it measures transfer characteristics and the output side characteristics.Current transfer ratio (2)*6*6*6TYP.6050031.050µA2.0µA1.00.021.719150.4RISO5×1010DC500V, 40 to 60%RH10 11CfV=0, f=1MHzpF 1.00.60.23030(Ta=25ûC) High level output current (1)IF=0, VCC=15V, VO=15VIOH (2)High level output current (2)IOH (3)High level output current (3)VOLVµALow level supply currentI CCL0.4IF=16mA, VCC=4.5V, IO=2.4mAIF=16mA, VCC=15V, VO=OPEN120Low level output voltageResponse timeSheet No.: D2-A05102EN Model Line-up5Please contact a local SHARP sales representative to inquire about production status.PC457L0NIP0F SeriesPC457L0NIP0FPC457L0YIP0F ApprovedPackageModel No.DIN EN60747-5-2Taping3 000pcs/reelSheet No.: D2-A05102EN6Fig.1 Test Circuit for Propagation Delay TimeFig.2 Test Circuit for Instantaneous Common Mode Rejection VoltagePC457L0NIP0F SeriestPHLtPLH5V0VRLCL0.01µFVOL1.5VIFIFPulse inputPulse width 10µsDuty ratio 1/10IFMonitorVOVOVCC100*CL includes the probeand wiring capacitance.5V2V0.8VRLCL0.01µFVOLVOVOVOVCCIFGNDVCM+SWABVCM1.0kV0VCMHCML(IF=0)(IF=16mA)When SW is AWhen SW is B*CL includes the probe and wiring capacitance.Fig.3 Forward Current vs. Ambient TemperatureFig.4 Power Dissipation vs. Ambient TemperatureForward current IF (mA)Ambient temperature Ta (ûC)0510 15 20 255502550100125 758570Power dissipation P, PO (mW)Ambient temperature Ta (ûC)020404560801005502550100125 PPO758570Sheet No.: D2-A05102EN7Fig.7 Output Current vs. Output VoltageFig.8 Relative Current Transfer Ratio vs.Ambient TemperatureFig.5 Forward Current vs. Forward VoltageFig.6 Relative Current Transfer Ratio vs.Forward CurrentPC457L0NIP0F SeriesForward voltage VF (V)Forward current IF (mA)11.21.41.61.82 1101000.1Ta=70ûCTa=50ûCTa=25ûCTa=0ûCTa=25ûCTa=55ûCForward current IF (mA)Relative current transfer ratio (%)0.1110100 100150 2000VCC=4.5VVO=0.4VTa=25ûC50CTR=100% at IF=16mAOutput current IO (mA)810 12 14 16 180Dotted line showspulse characteristics46IF=25mAIF=20mAIF=15mAIF=10mAIF=5mAOutput voltage VO (V)0246810 1220 141618 Ta=25ûCVCC=5V2Relative current transfer ratio (%)90100 110 1201301401505060Ambient temperature Ta (ûC)5540200204060100 80IF=16mAVCC=4.5VVO=0.4V7080CTR=100% at Ta=25ûCFig.9 High Level Output Current vs.Ambient TemperatureRemarks : Please be aware that all data in the graph are just for reference and not for guarantee.Fig.10 Propagation Delay Time vs.Ambient TemperatureAmbient temperature Ta (ûC)High level output current IOH (nA)250255 075 1001101001 0000.1IF=0VCC=VO=30VVCC=VO=15VVCC=VO=5.5V5540200204060100 80Propagation delay time tPHL, tPLH (ns)0800400600Ambient temperature Ta (ûC)tPLHtPHL200IF=16mAVCC=5VRL=1.9kSheet No.: D2-A05102EN8 Design ConsiderationsTransistor of detector side in bipolar configuration may be damaged by static electricity due to its minute de- sign. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. Notes about static electricityIn order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of 0.01µF or more between VCC and GND near the device.In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is floating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED.The detector which is used in this device, has parasitic diode between each pins and GND.There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level.This product is not designed against irradiation and incorporates non-coherent LED. Design guide DegradationIn general, the emission of the LED used in photocouplers will degrade over time.In the case of long term operation, please take the general LED degradation (50% degradation over 5 years) into the design consideration.PC457L0NIP0F SeriesParameterInput currentSupply voltage Fan out (TTL load)MIN.TYP. 5MAX.165UnitmAVSymbolIFVCCNOperating temperature+7070ûC Topr Recommended Foot Print (reference)(Unit : mm)0.81.56.31.271.27 Recommended operating conditions For additional design assistance, please review our corresponding Optoelectronic Application Notes.Sheet No.: D2-A05102EN Manufacturing GuidelinesReflow Soldering:Reflow soldering should follow the temperature profile shown below.Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. Soldering MethodFlow Soldering :Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines.Flow soldering should be completed below 260ûC and within 10s.Preheating is within the bounds of 100 to 150ûC and 30 to 80s. Please don't solder more than twice.Hand solderingHand soldering should be completed within 3s when the point of solder iron is below 400ûC. Please don't solder more than twice.Other noticesPlease test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions.91234 30020010000(ûC)Terminal : 260ûC peak( package surface : 250ûC peak)Preheat150 to 180ûC, 120s or lessReflow220ûC or more, 60s or less(min)PC457L0NIP0F SeriesSheet No.: D2-A05102ENSolvent cleaning:Solvent temperature should be 45ûC or below Immersion time should be 3 minutes or lessUltrasonic cleaning:The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production.Recommended solvent materials:Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. Cleaning instructionsThis product shall not contain the following materials.And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).¥Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated di- phenyl ethers (PBDE). Presence of ODC10PC457L0NIP0F SeriesSheet No.: D2-A05102EN11PC457L0NIP0F Series Tape and Reel packagePackage materialsCarrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PSCarrier tape structure and DimensionsA12.0±0.3B5.5±0.1C1.75±0.1D8.0±0.1E2.0±0.1H7.4±0.1I0.3±0.05J3.1±0.1K4.0±0.1F4.0±0.1G1.5+0.1 0FEIDJGBACH5ûMAX.KHDimensions List(Unit : mm) acegfbda370b13.5±1.5c80±1.0d13±0.5e21±1.0f2.0±0.5g2.0±0.5Dimensions List(Unit : mm)Pull-out direction [Packing : 3 000pcs/reel]Reel structure and DimensionsDirection of product insertion Package specificationá The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems rela- ted to any intellectual property right of a third party re- sulting from the use of SHARP's devices.á Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the spec- ifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufac- turing locations are also subject to change without no- tice.á Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as:--- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics(ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as:--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)--- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc.(iii) SHARP devices shall not be used for or in connec- tion with equipment that requires an extremely high lev- el of reliability and safety such as:--- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba).á If the SHARP devices listed in this publication fall with-in the scope of strategic products described in the For- eign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP de- vices.á This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, elec- tronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.á Contact and consult with a SHARP representative if there are any questions about the contents of this pub- lication.12Sheet No.: D2-A05102EN Important NoticesPC457L0NIP0F Series[E239]
updated: 2020-09-22 21:28:47