PC357N1J000F

PC357N1J000F

SHARP MICROELECTRONICS

光隔离器 - 晶体管,光电输出
OPTOISO 3.75KV TRANS 4-MINI-FLAT
EU RoHSCompliant
Output TypeDC
Input TypeDC
Output DeviceTransistor
Number of Channels per Chip1
Minimum Isolation Voltage (Vrms)3750
Minimum Operating Temperature (°C)-30
Maximum Operating Temperature (°C)100
Maximum Forward Voltage (V)1.4
Maximum Collector Emitter Voltage (V)80
Maximum Current Transfer Ratio (%)600
Maximum Collector Current (mA)50
Maximum Collector Emitter Saturation Voltage (mV)200
Maximum Power Dissipation (mW)170
Maximum Reverse Voltage (V)6
Maximum Rise Time (us)18
Maximum Fall Time (us)18
Maximum Forward Current (mA)50
PackagingTape and Reel
Temperature GradeCommercial
MountingSurface Mount
Package Height (mm)2.6
Package Length (mm)3.6
Package Width (mm)4.4
PCB changed4
Standard Package NameSOIC
Supplier PackageMini-Flat
Pin Count4
Lead ShapeGull-wing Lead (L-Lead)
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PC357NJ0000FSeries1.Recognized by UL1577 (Double protection isolation), file No. E64380 (as model No. PC357)2. Package resin : UL flammability grade (94V-0) Features Agency approvals/Compliance1. Hybrid substrates that require high density mounting2. Programmable controllers ApplicationsMini-flat Package,General Purpose Photocoupler1. 4-pin Mini-flat package2. Double transfer mold package (Ideal for Flow Soldering)3. High collector-emitter voltage (VCEO : 80V)4. Current transfer ratio (CTR) : MIN. 50% at IF=5mA, VCE=5V5. Several CTR ranks available 6. High isolation voltage between input and output(Viso(rms) : 3.75kV)7. RoHS directive compliant DescriptionPC357NJ0000F Series contains an IRED optically coupled to a phototransistor.It is packaged in a 4-pin Mini-flat package. Input-output isolation voltage(rms) is 3.75kV. Collector-emitter voltage is 80V and CTR is 50% to 600% at input current of 5mA.1Sheet No.: D2-A00102FENDate Jun. 30. 2005© SHARP CorporationNoticeThe content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.PC357NJ0000F Series Internal Connection DiagramAnodeCathode Emitter Collector112342432Sheet No.: D2-A00102FEN Outline Dimensions(Unit : mm)43124.4±0.25.3±0.32.6±0.20.1±0.13.6±0.32.54±0.253570.4±0.10.5+0.40.27.0+0.2 0.7Anode markSHARP mark"S"Epoxy resin45û6û0.2±0.05Rank markDate codeFactory identification markPC357NJ0000F SeriesProduct mass : approx. 0.1gPlating material : SnCu (Cu : TYP. 2%)Date code (2 digit)Rank markRefer to the Model Line-up tableA.D.19901991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001MarkABCDEFHJKLMNMarkPRSTUVWX AB CMark12 3 4 5 6 7 8 9O N DMonthJanuaryFebruaryMarchAprilMayJuneJulyAugustSeptemberOctoberNovemberDecemberA.D2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012áá áá á á2nd digitMonth of production1st digitYear of productionFactory identification markFactory identification Markno markCountry of originJapanIndonesiaChina* This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actual status of the production3repeats in a 20 year cycleSheet No.: D2-A00102FENPC357NJ0000F SeriesSheet No.: D2-A00102FEN Electro-optical CharacteristicsParameterConditionsForward voltageReverse current Terminal capacitance Collector dark currentCollector-emitter breakdown voltageTransfercharac-teristicsEmitter-collector breakdown voltageCollector currentCollector-emitter saturation voltageIsolation resistance Floating capacitanceMIN. 6802.55×1010 TYP.1.230 50.11×10110.64 3MAX.1.410250 300.21.018 18UnitVµApFnA100V VmAVpFµs µsSymbolVFIRCtICEOBVCEOBVECOICVCE (sat)CftrtfRISOResponse timeRise timeFall timeInputOutputIF=20mA VR=4VV=0, f=1kHzVCE=50V, IF=0 IC=0.1mA, IF=0 IE=10µA, IF=0 IF=5mA, VCE=5VIF=20mA, IC=1mAV=0, f=1MHzVCE=2V, IC=2mA, RL=100DC500V, 40 to 60%RH(Ta=25ûC) Absolute Maximum Ratings(Ta=25ûC)ParameterSymbolUnitInputForward currentmA*1Peak forward currentAPower dissipationmWOutputCollector-emitter voltageVEmitter-collector voltageVCollector currentmACollector power dissipationmWTotal power dissipationmW*2Isolation voltageOperating temperatureûCStorage temperatureûC*3Soldering temperatureIFIFMPVCEOVECOICPCPtotViso (rms)ToprTstgTsolûC*1 Pulse width100µs, Duty ratio : 0.001*2 40 to 60%RH, AC for 1 minute, f=60Hz*3 For 10sRating50170Reverse voltageVVR68065015017030 to +10040 to +1252603.75kV 4PC357NJ0000F SeriesSheet No.: D2-A00102FEN Model Line-upModel No.with or withoutABCDA or BB or CC or DA, B or C B, C or DA, B, C or DIC [mA](IF=5mA, VCE=5V, Ta=25ûC)2.5 to 30.04.0 to 8.06.5 to 13.010.0 to 20.0 15.0 to 30.04.0 to 13.0 6.5 to 20.010.0 to 30.04.0 to 20.0 6.5 to 30.0 4.0 to 30.0PC357NJ0000F PC357N1J000F PC357N2J000F PC357N3J000F PC357N4J000F PC357N5J000F PC357N6J000F PC357N7J000F PC357N8J000F PC357N9J000F PC357N0J000F3 000pcs/reelTapingPC357NTJ000F PC357N1TJ00F PC357N2TJ00F PC357N3TJ00F PC357N4TJ00F PC357N5TJ00F PC357N6TJ00F PC357N7TJ00F PC357N8TJ00F PC357N9TJ00F PC357N0TJ00F750pcs/reelRank markPackage5Please contact a local SHARP sales representative to inquire about production status.PC357NJ0000F SeriesSheet No.: D2-A00102FEN300250 200 150 10050017005010025Total power dissipation Ptot (mW)30Ambient temperature Ta (ûC)Fig.4 Total Power Dissipation vs. Ambient TemperatureForward current IF (mA)Forward voltage VF (V)50ûC25ûC0ûC00.511.522.533.5 10100125ûCTa=75ûCFig.6 Forward Current vs. Forward VoltageDuty ratio10100Peak forward current IFM (mA)103102101Pulse width100µsTa=25ûC10 0001 0001Fig.5 Peak Forward Current vs. Duty Ratio0255075 100125 7060 50 40 30 20 100Forward current IF (mA) 30Ambient temperature Ta(ûC)Fig.1 Forward Current vs. Ambient TemperatureDiode power dissipation P (mW) 100801206040 200050551007030Ambient temperature Ta (ûC)Fig.2 Diode Power Dissipation vs. Ambient Temperature00255 075 100125 200150 10050Collector power dissipation PC (mW)30Ambient temperature Ta (ûC)Fig.3 Collector Power Dissipation vs. Ambient Temperature 6PC357NJ0000F SeriesSheet No.: D2-A00102FENCollector dark current ICEO (A)Ambient temperature Ta (ûC)806040200 3010010510610710810910101011VCE=50VFig.11 Collector Dark Current vs. Ambient Temperature0.010.1110 100.11100Response time (µs)VCE=2VIC=2mATa=25ûCtstdtftrLoad resistance RL (k)Fig.12 Response Time vs. Load Resistance 806004050100150Relative current transfer ratio(%) 30020 100Ambient temperature Ta (ûC)IF=5mAVCE=5VFig.9 Relative Current Transfer Ratio vs. Ambient Temperature100200 30Collector-emitter saturation voltage VCE (sat) (V)0.160.10.0640060800.020.040.080.120.14Ambient temperature Ta (ûC)IF=20mAIC=1mAFig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature7504020100108642 0305mA10mA20mACollector current IC (mA)Collector-emitter voltage VCE (V)Ta=25ûCPC(MAX.)IF=30mAFig.8 Collector Current vs. Collector-emitter Voltage1001010.1Current transfer ratio CTR (%) 2004000100300500Forward current IF (mA)VCE=5VTa=25ûCFig.7 Current Transfer Ratio vs. Forward CurrentPC357NJ0000F SeriesSheet No.: D2-A00102FENRemarks : Please be aware that all data in the graph are just for reference and not for guarantee.810%90%OutputInputInputPlease refer to the conditions in Fig.12OutputRLVCCRDtstdtrtfVCEFig.13 Test Circuit for Response Time81230 0Collector-emitter saturation voltageVCE (sat) (V)76 5 4 3 2 11mA3mA5mA7mA1569Forward current IF (mA)IC=0.5mATa=25ûCFig.14 Collector-emitter Saturation Voltage vs. Forward CurrentPC357NJ0000F SeriesSheet No.: D2-A00102FEN Design ConsiderationsWhile operating at IF<1.0mA, CTR variation may increase.Please make design considering this fact.This product is not designed against irradiation and incorporates non-coherent IRED. DegradationIn general, the emission of the IRED used in photocouplers will degrade over time.In the case of long term operation, please take the general IRED degradation (50% degradation over 5 years) into the design consideration. For additional design assistance, please review our corresponding Optoelectronic Application Notes.9 Design guide Design Considerations Recommended Foot Print (reference)1.52.540.86.3(Unit : mm)PC357NJ0000F SeriesSheet No.: D2-A00102FEN Manufacturing Guidelines10Reflow Soldering:Reflow soldering should follow the temperature profile shown below.Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. Soldering MethodFlow Soldering :Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines.Flow soldering should be completed below 260ûC and within 10s.Preheating is within the bounds of 100 to 150ûC and 30 to 80s. Please don't solder more than twice.Hand solderingHand soldering should be completed within 3s when the point of solder iron is below 400ûC. Please don't solder more than twice.Other noticesPlease test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions.1234 30020010000(ûC)Terminal : 260ûC peak( package surface : 250ûC peak)Preheat 150 to 180ûC, 120s or lessReflow 220ûC or more, 60s or less(min)PC357NJ0000F SeriesSheet No.: D2-A00102FENPC357NJ0000F SeriesSolvent cleaning:Solvent temperature should be 45ûC or below Immersion time should be 3 minutes or lessUltrasonic cleaning:The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production.Recommended solvent materials:Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fine in actual using conditions since some materials may erode the packaging resin. Cleaning instructionsThis product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all. This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).¥Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated diphenyl ethers (PBDE). Presence of ODC11Sheet No.: D2-A00102FEN12 Package specification Tape and Reel package1. 3 000pcs/reelPackage materialsCarrier tape : A-PET (with anti-static material)Cover tape : PET (three layer system) Reel : PSCarrier tape structure and DimensionsA12.0±0.3B5.5±0.1C1.75±0.1D8.0±0.1E2.0±0.1H7.4±0.1I0.3±0.05J3.1±0.1K4.0±0.1F4.0±0.1G1.5+0.1 0FEIDJGBACH5ûMAX.KHDimensions List(Unit : mm)acegfbda370b13.5±1.5c80±1.0d13±0.5e21±1.0f2.0±0.5g2.0±0.5Dimensions List(Unit : mm)Pull-out direction [Packing : 3 000pcs/reel]Reel structure and DimensionsDirection of product insertion PC357NJ0000F SeriesSheet No.: D2-A00102FEN2. 750pcs/reelPackage materialsCarrier tape : A-PET (with anti-static material)Cover tape : PET (three layer system) Reel : PSCarrier tape structure and Dimensions13A12.0±0.3B5.5±0.1C1.75±0.1D8.0±0.1E2.0±0.1H7.4±0.1I0.3±0.05J3.1±0.1K4.0±0.1F4.0±0.1G1.5+0.1 0FEIDJGBACHDimensions List(Unit : mm)5ûMAX.KHacegfbda180b13.5±1.5c80±1.0d13±0.5e21±1.0f2.0±0.5g2.0±0.5Dimensions List(Unit : mm)Pull-out direction [Packing : 750pcs/reel]Reel structure and DimensionsDirection of product insertion PC357NJ0000F Seriesá The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices.á Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice.á Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as:--- Personal computers --- Office automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics(ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as:--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)--- Traffic signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc.(iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as:--- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba).á If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.á This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party.á Contact and consult with a SHARP representative if there are any questions about the contents of this publication.14Sheet No.: D2-A00102FEN Important NoticesPC357NJ0000F Series[E182]
updated: 2020-09-27 17:39:33