| MeltingPoint: | 423 ~ 424°F (217 ~ 218°C) |
| Category: | Soldering, Desoldering, Rework ProductsSolder |
| Form: | Jar, 17.64 oz (500g) |
| WireGauge: | - |
| MeshType: | 4 |
| Process: | Lead Free |
| BaseProductNumber: | 70-4823 |
| Mfr: | Kester Solder |
| ShippingInfo: | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| ShelfLifeStart: | Date of Manufacture |
| Diameter: | - |
| Digi-KeyStorage: | Refrigerated |
| Composition: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| RoHSStatus: | ROHS3 Compliant |
| Storage/RefrigerationTemperature: | 32°F ~ 50°F (0°C ~ 10°C) |
| ProductStatus: | Active |
| MoistureSensitivityLevel(MSL): | 1 (Unlimited) |
| ECCN: | EAR99 |
| ShelfLife: | 12 Months |
| REACHStatus: | REACH Unaffected |
| Weight: | - |
| Series: | NP560 |
| Type: | Solder Paste |
| Package: | Bulk |
| HTSUS: | 8311.30.6000 |
| FluxType: | No-Clean |
