HF115AC-0.0055-AC-90

制造商: 供应商:

分类: 热 - 垫,片

Datasheet:

描述: THERM PAD 21.84MMX18.79MM W/ADH

物料参数

Usage:TO-218, TO-220, TO-247
ThermalConductivity:0.8W/m-K
Category:Fans, Thermal ManagementThermalPads, Sheets
Shape:Rectangular
RoHSStatus:ROHS3 Compliant
Backing,Carrier:Fiberglass
Storage/RefrigerationTemperature:-
Color:Gray
ProductStatus:Active
MoistureSensitivityLevel(MSL):1 (Unlimited)
ECCN:EAR99
Outline:21.84mm x 18.79mm
Material:Phase Change Compound
ShelfLife:12 Months
Thickness:0.0055 (0.140mm)
Series:Hi-Flow® 115-AC
Type:Pad, Sheet
BaseProductNumber:HF115AC
Mfr:Bergquist
ThermalResistivity:0.35°C/W
Package:Bulk
HTSUS:3919.90.5060
ShelfLifeStart:Date of Manufacture
Adhesive:Adhesive - One Side