ADVANCED THERMAL SOLUTIONS

商品列表
ATS-53325D-C1-R0
供应商: Mouser Electronics
分类: Heat Sinks
描述: Heat Sinks MAXIGRIP HTSNK 32.5X32.5X9.5 (MM)
ThermalResistance@ForcedAirFlow: 11.30°C/W @ 200 LFM lnkProductPhoto: https://mm.digikey.com/Volume0/opasdata/d220001/medias/images/4843/684_ATS-53325D-C2-R0.jpg MaterialFinish: Black Anodized Category: Fans, Thermal ManagementThermalHeat Sinks Shape: Square, Fins standardLeadTime: 8 Weeks PackageCooled: BGA description: HEAT SINK 32.5 X 32.5 X 9.5MM PowerDissipation@TemperatureRise: - Product Status: Active manufacturer: Advanced Thermal Solutions Inc. manufacturerProductNumber: ATS-53325D-C1-R0 Fin Height: 0.374 (9.50mm) BaseProductNumber: ATS-533 Mfr: Advanced Thermal Solutions Inc. Thermal Resistance @ Natural: - Width: 1.280 (32.51mm) Diameter: - Package Cooled: BGA isNormallyStocking: True RoHSStatus: ROHS3 Compliant ThermalResistance@Natural: - ProductStatus: Active MoistureSensitivityLevel(MSL): Not Applicable ECCN: EAR99 Material: Aluminum ShelfLife: - REACHStatus: REACH Unaffected rolledUpProductNumber: ATS1156-ND FinHeight: 0.374 (9.50mm) Series: maxiGRIP Type: Top Mount Thermal Resistance @ Forced Air Flow: 11.30°C/W @ 200 LFM detailedDescription: Heat Sink BGA Aluminum Top Mount Length: 1.280 (32.51mm) datasheetUrl: https://www.qats.com/DataSheet/ATS-53325D-C1-R0 manufacturerUrl: /en/supplier-centers/advanced-thermal-solutions Package: Bulk Material Finish: Black Anodized Shelf Life: - HTSUS: 8473.30.5100 Attachment Method: Clip, Thermal Material AttachmentMethod: Clip, Thermal Material rolledUpProductId: 1284870 Power Dissipation @ Temperature Rise: - Base Product Number: ATS-533
ATS031031008-PF-10G
供应商: Mouser Electronics
分类: Heat Sinks
描述: Heat Sinks HIGH PERF FIN FIN B/A CROSS CUT H/S
ProductCategory: HeatSinks Manufacturer: AdvancedThermalSolutions FinStyle: CrossCutFin Brand: AdvancedThermalSolutions Color: Black Series: ATS
ATS-59002-C1-R0
供应商: Mouser Electronics
分类: Dissipadores de calor
描述: Dissipadores de calor MAXIGRIP HTSNK 25 X 32 X 13 (MM)
Categoriadeproduto: Dissipadoresdecalor Fabricante: AdvancedThermalSolutions Produto: HeatSinks Estilodemontagem: SnapOn Materialdissipadordecalor: Aluminum Estilodaaleta: AngledFin Resistênciatérmica: 6.5C/W Comprimento: 32mm Largura: 25mm Altura: 13mm Projetadopara: BGA Marca: AdvancedThermalSolutions Cor: Black Embalagem: Bulk Série: maxiGRIP Quantidadedopacotedefábrica: 100
ATS-56011-C1-R0
供应商: Mouser Electronics
分类: Heat Sinks
描述: Heat Sinks MAXIFLOW HTSNK 57.5X57.5X12.5 (MM)
ThermalResistance@ForcedAirFlow: 2.30°C/W @ 200 LFM lnkProductPhoto: https://mm.digikey.com/Volume0/opasdata/d220001/medias/images/810/ATS-56011-C3-R0.JPG MaterialFinish: Black Anodized Category: Fans, Thermal ManagementThermalHeat Sinks Shape: Square, Angled Fins standardLeadTime: 8 Weeks PackageCooled: ASIC description: HEAT SINK 57.5 X 57.5 X 12.5MM PowerDissipation@TemperatureRise: - Product Status: Active manufacturer: Advanced Thermal Solutions Inc. manufacturerProductNumber: ATS-56011-C1-R0 Fin Height: 0.492 (12.50mm) BaseProductNumber: ATS-560 Mfr: Advanced Thermal Solutions Inc. Thermal Resistance @ Natural: - Width: 2.264 (57.50mm) Diameter: - Package Cooled: ASIC isNormallyStocking: True RoHSStatus: ROHS3 Compliant ThermalResistance@Natural: - ProductStatus: Active MoistureSensitivityLevel(MSL): Not Applicable ECCN: EAR99 Material: Aluminum ShelfLife: - REACHStatus: REACH Unaffected rolledUpProductNumber: ATS1342-ND FinHeight: 0.492 (12.50mm) Series: maxiFLOW Type: Top Mount Thermal Resistance @ Forced Air Flow: 2.30°C/W @ 200 LFM detailedDescription: Heat Sink ASIC Aluminum Top Mount Length: 2.264 (57.50mm) datasheetUrl: https://www.qats.com/DataSheet/ATS-56011-C1-R0 manufacturerUrl: /en/supplier-centers/advanced-thermal-solutions Package: Bulk Material Finish: Black Anodized Shelf Life: - HTSUS: 8473.30.5100 Attachment Method: Thermal Tape, Adhesive (Included) AttachmentMethod: Thermal Tape, Adhesive (Included) rolledUpProductId: 1285056 Power Dissipation @ Temperature Rise: - Base Product Number: ATS-560
ATS-52300P-C1-R0
供应商: Mouser Electronics
分类: Heat Sinks
描述: Heat Sinks MAXIFLOW HTSNK 30 X 30 X 17.5 (MM)
ThermalResistance@ForcedAirFlow: 3.40°C/W @ 200 LFM lnkProductPhoto: https://mm.digikey.com/Volume0/opasdata/d220001/medias/images/4844/684_ATS-52300P-C2-R0.jpg MaterialFinish: Blue Anodized Category: Fans, Thermal ManagementThermalHeat Sinks Shape: Square, Angled Fins standardLeadTime: 8 Weeks PackageCooled: BGA description: HEAT SINK 30MM X 30MM X 17.5MM PowerDissipation@TemperatureRise: - Product Status: Active manufacturer: Advanced Thermal Solutions Inc. manufacturerProductNumber: ATS-52300P-C1-R0 Fin Height: 0.689 (17.50mm) BaseProductNumber: ATS-523 Mfr: Advanced Thermal Solutions Inc. Thermal Resistance @ Natural: - Width: 1.181 (30.00mm) Diameter: - Package Cooled: BGA isNormallyStocking: True RoHSStatus: ROHS3 Compliant ThermalResistance@Natural: - ProductStatus: Active MoistureSensitivityLevel(MSL): Not Applicable ECCN: EAR99 Material: Aluminum ShelfLife: - REACHStatus: REACH Unaffected rolledUpProductNumber: ATS1138-ND FinHeight: 0.689 (17.50mm) Series: maxiFLOW Type: Top Mount Thermal Resistance @ Forced Air Flow: 3.40°C/W @ 200 LFM detailedDescription: Heat Sink BGA Aluminum Top Mount Length: 1.181 (30.00mm) datasheetUrl: https://www.qats.com/DataSheet/ATS-52300P-C1-R0 manufacturerUrl: /en/supplier-centers/advanced-thermal-solutions Package: Bulk Material Finish: Blue Anodized Shelf Life: - HTSUS: 8473.30.5100 Attachment Method: Thermal Tape, Adhesive (Included) AttachmentMethod: Thermal Tape, Adhesive (Included) rolledUpProductId: 1284852 Power Dissipation @ Temperature Rise: - Base Product Number: ATS-523
ATS-56012-C1-R0
供应商: Mouser Electronics
分类: 散热片
描述: 散热片 MAXIFLOW HTSNK 42 X 42 X 16 (MM)
制造商: AdvancedThermalSolutions 产品种类: 散热片 产品: HeatSinks 安装风格: Adhesive 散热片材料: Aluminum 散热片样式: AngledFin 热阻: 2.8C/W 长度: 42mm 宽度: 42mm 高度: 16mm 设计目的: BGA 商标: AdvancedThermalSolutions 颜色: Gold 封装: Bulk 系列: maxiFLOW 工厂包装数量: 100
ATS-53450D-C1-R0
供应商: Mouser Electronics
分类: Heat Sinks
描述: Heat Sinks MAXIGRIP HTSNK 45 X 45 X 9.5 (MM)
ProductCategory: HeatSinks Manufacturer: AdvancedThermalSolutions Product: HeatSinks MountingStyle: SnapOn HeatsinkMaterial: Aluminum FinStyle: StraightFin ThermalResistance: 8.41C/W Length: 45mm Width: 45mm Height: 9.5mm Designedfor: BGA Brand: AdvancedThermalSolutions Color: Black Packaging: Bulk Series: maxiGRIP FactoryPackQuantity: 100
ATS-53170K-C1-R0
供应商: Mouser Electronics
分类: Dissipadores de calor
描述: Dissipadores de calor MAXIGRIP HTSNK 17 X 17 X 14.5 (MM)
Categoriadeproduto: Dissipadoresdecalor Fabricante: AdvancedThermalSolutions Produto: HeatSinks Estilodemontagem: SnapOn Materialdissipadordecalor: Aluminum Estilodaaleta: StraightFin Resistênciatérmica: 13.1C/W Comprimento: 17mm Largura: 17mm Altura: 14.5mm Projetadopara: BGA Marca: AdvancedThermalSolutions Cor: Black Embalagem: Bulk Série: maxiGRIP Quantidadedopacotedefábrica: 100
ATS-60004-C1-R0
供应商: Mouser Electronics
分类: Heat Sinks
描述: Heat Sinks MAXIFLOW HTSNK 61 X 58.2 X 6.1 (MM)
ATS-59004-C1-R0
供应商: Mouser Electronics
分类: Cuerpo de Refrigeración
描述: Cuerpo de Refrigeración MAXIGRIP HTSNK 43 X 55 X 12 (MM)
Categoríadeproducto: CuerpodeRefrigeración Fabricante: AdvancedThermalSolutions Producto: HeatSinks Estilodemontaje: SnapOn Materialdesumiderotérmico: Aluminum Estilodealeta: AngledFin Resistenciatérmica: 3.2C/W Longitud: 55mm Ancho: 43mm Altura: 12mm Diseñadopara: BGA Marca: AdvancedThermalSolutions Color: Black Empaquetado: Bulk Serie: maxiGRIP Cantidaddeempaquedefábrica: 100